EM828 Sn96.5Ag3Cu0.5 Solder Paste 500g Jar, Water Soluble, Metal % = 89.5%, Powder Type = T3, Lead Free

  • Manufacturer: Kester
  • Model # 70-0403-0810 (7004030810)
  • Pemro # KES-1103
  • $ 97.62/per jar
  • Available to Order

Minimum order quantity is 10

Must order in multiples of 10

Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.

Performance Characteristics:
• Low-voiding underneath area array components
• Excellent wetting on a variety of metallizations
• Residues are easily removed in hot DI water
• Long stencil life and tack time (process dependent)
• Tremendous brick definition and slump resistance for reduction of bridging defects
• Print speed up to 150 mm/sec (6 in/sec)
• Capable of breaks in printing of up to 60 minutes without any kneading
• Classified as ORH1 per J-STD-004A