NXG1 Sn96.5Ag3Cu0.5 Solder Paste 500g Jar, No-Clean, Metal % = 88.5%, Powder Type = T3, Lead Free

  • Manufacturer: Kester
  • Model # 70-3213-0810 (7032130810)
  • Pemro # KES-1461
  • $ 99.27/per jar
  • Available to Order

Minimum order quantity is 10

Must order in multiples of 10

Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.

Performance Characteristics:
• Excellent wetting to a variety of metals
• Capable of print speeds up to 25-200 mm/sec (1-8 in/sec)
• Resistant to slump
• Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
• Long stencil and tack life (process dependent)
• Excellent release from stencil
• Capable of 120-minute break times in printing
• Clean cosmetic aesthetics after reflow
• Reflowable in air or nitrogen