Kester 70-0605-0810 (7006050810)

EM907 Sn96.5Ag3Cu0.5 Solder Paste 500g Jar, No-Clean, Metal % = 88.5%, Powder Type = T3, Lead Free

  • Manufacturer: Kester
  • Model # 70-0605-0810 (7006050810)
  • Pemro # KES-1328
  • $ 101.13/each
  • Available to Order

Minimum order quantity is 10

Must order in multiples of 10

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Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004.

Performance Characteristics:
• Lead-free joints that closely resemble those achieved with SnPb solder paste
• Excellent solderability to a wide variety of surface metalizations, including NiAu, ImSn and ImAg
• High print speeds up to 150 mm/s
• Capable of 60 minute break times in printing
• Stencil life: 12+ hours (process dependent)
• Excellent printing characteristics to 16 and 20 mils pitch
• Excellent print and reflow characteristics for 0201 applications
• Stable tack life
• Classified as ROL1 per J-STD-004