EM907-SAC305-T3-NC-LF-500g Paste
- Manufacturer: Kester
- Model # 70-0605-0810 (7006050810)
- Pemro # KES-1328
- $81.79/each
Kester Solder Paste P/N 7006050810 (Flux-EM907, Type 3, No-Clean, Lead-Free, Sn96.5Ag3.0Cu0.5, Metals 0.885). Price and package is in 500g Jars.
Kester EnviroMarkTM 907 is a lead-free, air and nitrogen
reflowable no-clean solder paste specifically
designed for the thermal requirements of lead free
alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The
paste flux system allows joint appearances that
closely resemble that achieved with SnPb alloys.
EM907 is capable of stencil printing downtimes up
to 60 minutes with an effective first print down to
20 mils without any kneading. EM907 also
exhibits excellent continual printability for fine pitch
(0.4mm/16 mils) and is able to print at high speeds
up to 6”/s (150 mm/s). This solder paste also
exceeds the reliability standards required by
J-STD-004.
• Lead free joints that closely resemble those
achieved with SnPb solder paste
• Excellent solderability to a wide variety of
surface metallizations, including Ni/Au, Im Sn
and Im Ag
• High print speeds up to 150 mm/s
• Capable of 60 minute break times in printing
• Stencil life: 12+ hours (process dependent)
• Excellent printing characteristics to 16 and 20
mils pitch
• Excellent print and reflow characteristics for
0201 applications
• Stable tack life
• Classified as ROL0 per J-STD-004
Click here for Datasheet
Click here for MSDS