EP256HA Sb62Pb36Ag2 Solder Paste 500g Jar, No-Clean, Metal % = 90%, Powder Type = T3

  • Manufacturer: Kester
  • Model # 70-0202-0310 (7002020310)
  • Pemro # KES-1530
  • $ 71.34/per jar
  • Available to Order

Minimum order quantity is 50

Must order in multiples of 10

EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning. EP256HA is classified as ROL0.

Performance Characteristics:
• Excellent solderability on difficult to solder to components, i.e., PdAg
• High activity on all substrates, including OSPs
• Capable of 90-minute break times in printing
• Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
• High print speeds to 150 mm/sec (6 in/sec)
• Stable tack over 8+ hours
• Stencil life: 8+ hours (process dependent)
• Scrap is reduced due to less paste dry out
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78